The Hot Air Solder Leveling (HASL) process has been the preferred coating procedure
of the Printed Circuit Board (PCB) Industry for the past 20 years.
Even with new regulations eliminating lead from solder, the HASL process has not lost its popularity or feasibility and still remains the preferred coating of PCB manufactures worldwide.
Nihon Superior Co., Ltd. (
) has developed the patented SN100CL Sn-Ni-Cu HASL alloy. This alloy has been specially designed as an alternative to Sn-Pb alloy and provides a high quality surface finish for use in the HASL process. In addition,
ACS Technologies, manufacturer of HASL Systems has completed the necessary modifications to their Model
LF-3024 in order to comply with the process parameters required by
A new designed Solder Pot and
Solder Pump has
also been designed specifically to handle Lead-Free
of the Solder Pot extends the pot-life by
reducing the frequency of copper extraction from
the Solder Pot.
Solder Pot exchange is very
expensive and time consuming.
The new designed
Solder Pump has been greatly
increased in size for better Solder Pot
circulation. The stainless steel material of the
Pump Shaft has also been upgraded to deal with
There is no need
to double cycle every PCBs.
Solder Pot now has a Stand-By
Mode Feature which reduces dross build-up in the
Solder Pot Weir while PCBs are not being
leveled. If the system has not been cycled for
30 seconds the Solder Pot Motor will reduce to
minimal speed, slowing down the Solder Pot
ACS has specially designed their Hot Air
Reservoir Heating System (HARHS) to provides a steady flow of
pressurized heated air to the Air Knives. The
ACS HARHS System provides over 2000 cubic inches
of hot pressurized air!
ACS and Lantronic HASL Systems are successfully running the new Sn-Ni-Cu HASL
PLus, ACS is working closely with
the HASL alloy Nihon Superior SN100CL lead-free alloy, in an attempt to provide direction, support, and service to the PCB industry. Our expertise and experience with the
Lead-Free alloy provides a smooth and trouble-free transition when converting over to the new
Lead-Free Sn-Ni-Cu HASL alloy.
ACS has experienced the following advantages when using the SN100CL Sn-Ni-Cu
Lead-Free alloy in the ACS and Lantronic HASL
As we move ahead into the next generation of HASL finishes, be confident in knowing that the transition is brief and undisruptive. Your current pre-clean and fluxing applications need no modifications. ACS is available to assist you with this procedure. Time is of the essence, and procrastinating can lead to playing catch up or even lose of
business to your competition. It is also possible that you will need to make modifications in other processes due to the higher processing temperatures, so now is the time to get all the bugs worked out. ACS can be reached at (479) 846-2403 or visit our web-site at www.acs-tech.com.