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*Immersion Silver*
Pros	Cons
Good Wettability	Poor Shelf-Life: Must be vacuumed packed for shipping Must be vacuumed packed for storage *Must not handle Surface Areas
Good Coplanarity
Good Reflow Cycles
Good Process times
Low Cost	Fair Process Window
Good Process Control	Poor Adhesion
Good Electrical Testability	Difficult to Re-Work

*Organic Solderability Preservative - OSP*
Pros	Cons
Good Coplanarity	Poor Shelf-Life: Degrades with High Temperature Must not handle Surface Areas
Good Surface Oxidation
Re-Workable
Very Low Cost	Reflow Cycles
Good Process Window	Flux Sensitivity
Good Process Control	Poor Wettability
	Very Poor Electrical Testability
	Poor Adhesion

*Electroless Nickel Immersion Gold - ENIG*
Pros	Cons
Good Wettability	High Cost
Good Coplanarity	Complex Process
Good Reflow Cycles	Not Re-Workable
Good Surface Oxidation	Ni/Sn brittle Solder Joints
Good Shelf-Life	Field Failure
Good Adhesion	Fair Process Window
Wire Bonding	Fair Process Control
Keypads
Good Electrical Testability

*Hard Gold*
Pros	Cons
Good Wettability	High Cost
Good Coplanarity	Not Re-Workable
Good Reflow Cycles
Good Surface Oxidation
Good Shelf-Life
Good Process Window
Good Process Control
Good Adhesion
Good Electrical Testability

*White Tin*
Pros	Cons
Good Wettability	Long Process Time
Good Coplanarity	Fair Process Window
Good Reflow Cycles	Possible Tin Whiskers
Good Surface Oxidation	Problems if Tin Thickness is Low
Low Cost
Good Process Control
Good Adhesion
Good Electrical Testability

*Lead-Free Hot Air Solder Leveling*
Pros	Cons
Excellent Wettability	Process Control
Much Improved Coplanarity over Sn/Pb	Heat Cycle
Excellent Reflow Cycles
Excellent Surface Oxidation
Very Low Cost
Re-Workable
Good Process Window
Good Adhesion
Excellent Solder Joints
Excellent Shelf-Life
Good Electrical Testability